01 — Services

From bare board to finished device.

Two fully separate SMT and THT lines, ROHS and Non-ROHS, plus value added services — from prototype to series.

Capabilities
TechnologySMT + THT
Min. component0201
PackagesQFP · QFN · BGA · CSP
Speedup to 150,000/h
SolderingROHS + Non-ROHS
Lines2 separate

ROHS & NON-ROHS

Two lines. Zero compromise.

Separate paths for leaded and lead-free production protect your assemblies from contamination.

2

SEPARATE LINES

02Machines that make it possible

We continuously invest in the latest generation of equipment.

SMT PICK&PLACE Samsung-Hanwha SM482+ · 2019.
SMT PICK&PLACE Samsung CP-45FV Neo · 2008.
REFLOW, 7 ZONES Heller 1707 MKIII · 2011.
INLINE STENCIL PRINTER EKRA X4SI · 2016.
LEAD-FREE WAVE ERSA ESV250C · 2012.
3D AOI INSPECTION Parmi Xceed · 2020.

03From inquiry to delivery

A clear, repeatable flow — every step documented.

01

Inquiry & DFM

Documentation review and manufacturability feedback.

02

Sourcing

Boards and components — turn-key or to your BOM.

03

Stencil & paste

EKRA X4SI applies solder paste, SPI control.

04

SMT assembly

Pick&place down to BGA and 0201.

05

Reflow

Heller 7-zone profile, ROHS or Non-ROHS.

06

THT & wave

Through-hole and lead-free wave soldering.

07

3D AOI & test

Optical inspection, burn-in, functional.

08

Packing & delivery

Fitting, packing and delivery as agreed.

Two separate lines mean leaded and lead-free production never share the same path — no contamination.

SMD MICRO ELEKTRONIKA